The Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.
TY - JOUR
AU - Marković, Branislav
AU - Manasijević, Dragan
AU - Talijan, Nadežda
AU - Sokić, Miroslav
AU - Štrbac, Nada
AU - Patarić, Aleksandra
AU - Bugarčić, Mladen
PY - 2017
UR - https://ritnms.itnms.ac.rs/handle/123456789/457
AB - The Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.
PB - Savez inženjera metalurgije Srbije, Beograd
T2 - Metallurgical & Materials Engineering
T1 - Ternary bi-cu-ni alloys - thermodynamics, characterization, mechanical and electrical properties
EP - 254
IS - 3
SP - 241
VL - 23
DO - 10.30544/316
UR - conv_1218
ER -
@article{
author = "Marković, Branislav and Manasijević, Dragan and Talijan, Nadežda and Sokić, Miroslav and Štrbac, Nada and Patarić, Aleksandra and Bugarčić, Mladen",
year = "2017",
abstract = "The Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.",
publisher = "Savez inženjera metalurgije Srbije, Beograd",
journal = "Metallurgical & Materials Engineering",
title = "Ternary bi-cu-ni alloys - thermodynamics, characterization, mechanical and electrical properties",
pages = "254-241",
number = "3",
volume = "23",
doi = "10.30544/316",
url = "conv_1218"
}
Marković, B., Manasijević, D., Talijan, N., Sokić, M., Štrbac, N., Patarić, A.,& Bugarčić, M.. (2017). Ternary bi-cu-ni alloys - thermodynamics, characterization, mechanical and electrical properties. in Metallurgical & Materials Engineering
Savez inženjera metalurgije Srbije, Beograd., 23(3), 241-254.
https://doi.org/10.30544/316
conv_1218
Marković B, Manasijević D, Talijan N, Sokić M, Štrbac N, Patarić A, Bugarčić M. Ternary bi-cu-ni alloys - thermodynamics, characterization, mechanical and electrical properties. in Metallurgical & Materials Engineering. 2017;23(3):241-254.
doi:10.30544/316
conv_1218 .
