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dc.creatorMarković, Branislav
dc.creatorŽivković, D.
dc.creatorManasijević, Dragan
dc.creatorSokić, Miroslav
dc.creatorMinić, Duško
dc.creatorTalijan, Nadežda
dc.creatorStajić-Trosić, Jasna
dc.date.accessioned2023-04-21T11:20:33Z
dc.date.available2023-04-21T11:20:33Z
dc.date.issued2014
dc.identifier.issn1733-3490
dc.identifier.urihttps://ritnms.itnms.ac.rs/handle/123456789/325
dc.description.abstractThe Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. In this study microstructure investigation of the slow-cooled Bi-Cu-Ni samples was done using SEM-EDS analysis. The samples compositions were chosen along three cross-sections with molar ratio Cu:Ni=1:3, 1:1 and 3:1. The experimentally obtained phase structure was compared with the results of thermodynamic calculation according to CALPHAD method. Also, new results regarding thermal and electrical properties investigations of these alloys are presented in this paper, based on DSC and electroconductivity measurements.en
dc.publisherPolish Acad Sciences Committee Metallurgy, Krakow
dc.relationinfo:eu-repo/grantAgreement/MESTD/Basic Research (BR or ON)/172037/RS//
dc.relationCOST Action [MP 0602]
dc.rightsopenAccess
dc.rights.urihttps://creativecommons.org/licenses/by-nc/4.0/
dc.sourceArchives of Metallurgy and Materials
dc.subjectlead-free soldersen
dc.subjectcharacterizationen
dc.subjectBi-Cu-Ni alloysen
dc.titleThermal, structural and electrical properties of some bi-cu-ni alloysen
dc.typearticle
dc.rights.licenseBY-NC
dc.citation.epage120
dc.citation.issue1
dc.citation.other59(1): 117-120
dc.citation.rankM22
dc.citation.spage117
dc.citation.volume59
dc.identifier.doi10.2478/amm-2014-0018
dc.identifier.fulltexthttps://ritnms.itnms.ac.rs/bitstream/id/121/322.pdf
dc.identifier.rcubconv_689
dc.identifier.scopus2-s2.0-84898607931
dc.identifier.wos000333983900018
dc.type.versionpublishedVersion


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