Thermal, structural and electrical properties of some bi-cu-ni alloys

2014
Autori
Marković, Branislav
Živković, D.
Manasijević, Dragan

Sokić, Miroslav

Minić, Duško

Talijan, Nadežda
Stajić-Trosić, Jasna
Članak u časopisu (Objavljena verzija)
Metapodaci
Prikaz svih podataka o dokumentuApstrakt
The Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. In this study microstructure investigation of the slow-cooled Bi-Cu-Ni samples was done using SEM-EDS analysis. The samples compositions were chosen along three cross-sections with molar ratio Cu:Ni=1:3, 1:1 and 3:1. The experimentally obtained phase structure was compared with the results of thermodynamic calculation according to CALPHAD method. Also, new results regarding thermal and electrical properties investigations of these alloys are presented in this paper, based on DSC and electroconductivity measurements.
Ključne reči:
lead-free solders / characterization / Bi-Cu-Ni alloysIzvor:
Archives of Metallurgy and Materials, 2014, 59, 1, 117-120Izdavač:
- Polish Acad Sciences Committee Metallurgy, Krakow
Finansiranje / projekti:
- Savremeni višekomponentni metalni sistemi i nanostrukturni materijali sa različitim funkcionalnim svojstvima (RS-172037)
- COST Action [MP 0602]
DOI: 10.2478/amm-2014-0018
ISSN: 1733-3490