TY  - JOUR
AU  - Mladenović, Ivana O.
AU  - Lamovec, Jelena S.
AU  - Vasiljević‑Radović, Dana
AU  - Vuković, Nikola
AU  - Radojević, Vesna
AU  - Nikolić, Nebojša D.
PY  - 2024
UR  - https://ritnms.itnms.ac.rs/handle/123456789/1283
AB  - Correlation between morphology of electrolytically produced copper thin films and their hardness has been considered. The Cu films were electrodeposited by galvanostatic (DC) and by the pulsating current (PC) regimes on cathodes of limiting values of hardness (Cu, brass, and Si(111)) from the basic sulfate electrolytes without and with addition of leveling/brightening additives, without and with various ways of electrolyte stirring (ultrasound and magnetic stirring), and characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM) techniques. Hardness of Cu films was determined by microindentation and by application of composite hardness models (CHMs), such as Cheng–Gao (C–G) and Korsunsky (K), with the aim to eliminate a contribution of cathode hardness in the measured film hardness and to determine the absolute hardness of the Cu films. The fine-grained films obtained from the basic sulfate electrolyte were harder than the smooth film obtained from the electrolyte with additives and that obtained by the PC regime, indicating that the PC produced film represents transitional form between these two types of the films. The obtained values of the absolute film hardness in the 1.135–1.647 GPa range were in line with already published values for the electrolytically produced Cu thin films, clearly indicating on successful implementation of CHMs in determination of the absolute hardness of thin films. Correlation between morphology and hardness of Cu films was discussed by the basic laws of electrocrystallization and phenomena on boundary among grains during microindentation processes.
PB  - Springer-Verlag GmbH Germany
T2  - Journal of Solid State Electrochemistry
T1  - Correlation between morphology and hardness of electrolytically produced copper thin films
DO  - 10.1007/s10008-024-05948-w
ER  - 

@article{
author = "Mladenović, Ivana O. and Lamovec, Jelena S. and Vasiljević‑Radović, Dana and Vuković, Nikola and Radojević, Vesna and Nikolić, Nebojša D.",
year = "2024",
abstract = "Correlation between morphology of electrolytically produced copper thin films and their hardness has been considered. The Cu films were electrodeposited by galvanostatic (DC) and by the pulsating current (PC) regimes on cathodes of limiting values of hardness (Cu, brass, and Si(111)) from the basic sulfate electrolytes without and with addition of leveling/brightening additives, without and with various ways of electrolyte stirring (ultrasound and magnetic stirring), and characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM) techniques. Hardness of Cu films was determined by microindentation and by application of composite hardness models (CHMs), such as Cheng–Gao (C–G) and Korsunsky (K), with the aim to eliminate a contribution of cathode hardness in the measured film hardness and to determine the absolute hardness of the Cu films. The fine-grained films obtained from the basic sulfate electrolyte were harder than the smooth film obtained from the electrolyte with additives and that obtained by the PC regime, indicating that the PC produced film represents transitional form between these two types of the films. The obtained values of the absolute film hardness in the 1.135–1.647 GPa range were in line with already published values for the electrolytically produced Cu thin films, clearly indicating on successful implementation of CHMs in determination of the absolute hardness of thin films. Correlation between morphology and hardness of Cu films was discussed by the basic laws of electrocrystallization and phenomena on boundary among grains during microindentation processes.",
publisher = "Springer-Verlag GmbH Germany",
journal = "Journal of Solid State Electrochemistry",
title = "Correlation between morphology and hardness of electrolytically produced copper thin films",
doi = "10.1007/s10008-024-05948-w"
}

Mladenović, I. O., Lamovec, J. S., Vasiljević‑Radović, D., Vuković, N., Radojević, V.,& Nikolić, N. D.. (2024). Correlation between morphology and hardness of electrolytically produced copper thin films. in Journal of Solid State Electrochemistry
Springer-Verlag GmbH Germany..
https://doi.org/10.1007/s10008-024-05948-w

Mladenović IO, Lamovec JS, Vasiljević‑Radović D, Vuković N, Radojević V, Nikolić ND. Correlation between morphology and hardness of electrolytically produced copper thin films. in Journal of Solid State Electrochemistry. 2024;.
doi:10.1007/s10008-024-05948-w .

Mladenović, Ivana O., Lamovec, Jelena S., Vasiljević‑Radović, Dana, Vuković, Nikola, Radojević, Vesna, Nikolić, Nebojša D., "Correlation between morphology and hardness of electrolytically produced copper thin films" in Journal of Solid State Electrochemistry (2024),
https://doi.org/10.1007/s10008-024-05948-w . .